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MMIC Packaging Process Development Engineer

Date:  May 4, 2021
Country:  United States
State / Province:  California
City:  Santa Rosa
Job Type:  Regular
Job ID:  40683

Job Description

Keysight Technologies, the world's premier measurement company, has an opening for a MMIC Packaging Process Development Engineer at the High Frequency Technology Center in Santa Rosa, California. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes and coastline while working on state-of-the-art ICs and devices.


Process Development Engineers at HFTC are responsible for advanced process development and for maintaining custom, cutting edge, micro and nano-fabrication technologies for high performance microwave and millimeter-wave applications. The technologies include InP and GaAs-based HBTs, HEMTs, and diodes, as well as high-frequency packaging solutions which enable key competitive differentiation of Keysight’s industry-leading RF, microwave, mmWave and high bit rate instruments.


The focus of this position is on advanced high frequency packaging and die fab/backside process development for current and future MMIC products.  These processes include heterogeneous integration of high frequency components, application of die shielding and heat sinking, MMIC wafer thinning, wafer separation, visual inspection, and outgoing quality. Responsibilities include but are not limited to the following:


  • Driving heterogeneous integration development projects that are critical to Keysight’s high frequency packaging roadmap
  • Ownership of die fab and assembly processes and equipment to drive R&D and sustain production activities.
  • Work closely with other process, integration, product, and circuit design engineers to define process and device performance targets
  • Define process flows, develop new fabrication processes and drive continuous process improvement (CPI) efforts to maximize product yield
  • Ensure successful transfer and maintenance of new technologies into manufacturing. Project objectives will encompass performance, reliability and manufacturing goals.
  • Lead capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.


Keysight provides an outstanding benefits package that includes: highly competitive pay, profit sharing, stock purchase, company pension, 401k with matching, relocation assistance, paid time off, medical, dental, and vision insurance, multiple education assistance options, and opportunities to interact with some of the world’s top engineers and scientists.

Job Qualifications

M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience. ( BS with 5+ years of applicable packaging experience) 

  • 2-5+ years of proven experience in the following areas is required:
    • Advanced packaging & assembly techniques
    • Heterogeneous integration
    • MMIC wafer thinning and die fab operations such as laser & saw separation
    • Chip sort, auto-visual
    • Other backend processes
  • Experience with advanced semiconductor devices and packaging is required
  • Specific skills in III-V semiconductor processing is highly preferred
  • Experience with statistical process control and design of experiments is required


Candidates must have strong problem-solving and analytical skills as well as excellent interpersonal and communication skills for successful inter and intra-group interactions.


Must have strong self-initiative and proactive attitude

Job Function



Careers Privacy Statement 

***Keysight is an Equal Opportunity Employer.***

Keysight Technologies Inc. is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.

Candidates can be considered to work from the following locations:

Americas : United States : California : Santa Rosa

Job ID : 40683 

Nearest Major Market: Santa Rosa
Nearest Secondary Market: Petaluma

Job Segment: Package Design, Process Engineer, Manufacturing Engineer, Engineer, Electrical, Engineering, Manufacturing